Tualatin, OR, January 2019 — LPKF Laser & Electronics will be exhibiting at the IPC/APEX Expo in San Diego, California in booth 1651 this year, demonstrating its PCB depaneling and flex PCB drilling laser systems.

LPKF’s flex drilling systems are equipped for high through-put, high-yielding PCB drilling applications, allowing engineers to increase panel yield by an estimated 20% or even save on production steps. Common applications include drilling microvias, clean cutting of cover layer material, efficient and space-saving profiling, and blank cutting with cut edge quality. Engineers increase margins with the new generation of flexible laser machine for more efficient PCB processing.

Additionally, laser technology achieves residue-free results that require no post-processing, saving the process step. Further, the number of modules per panel and the packing density can be increased, which reduces the manufacturing cost.

LPKF’s PCB depaneling systems are compact, developed for extremely clean and fast cutting PCB panels and cover layers. It reduces lead times and eliminates tooling costs of layout changes. The substrates are held securely on a vacuum table. This is ideal for depaneling, cutting and engraving a variety of substrates (cover layers, rigid, flex and rigid/flex).

In addition to these systems, LPKF will also be demonstrating its laser plastic welding systems and rapid PCB prototyping technology at the show. For more information on LPKF’s latest laser-based solutions, visit LPKF in booth 1651 at the 2019 IPC/APEX Expo or visit www.lpkfusa.com.

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