Products

TWX-40 allows gold deposits up to 8μin in ENIG and ENEPIG processing in a single step.

Read more: Uyemura Introduces TWX-40 Immersion Gold

KiCad schematic capture and printed circuit board online tool now includes a beta release of a library consisting of nearly 1,000 common parts for open source use.

Read more: Digi-Key Updates Common Parts Library for KiCad EDA Tool

HyperLynx printed circuit board simulation software now performs end-to-end, fully automated serializer/deserializer (SerDes) channel validation.

Read more: Mentor Upgrades HyperLynx Simulation Software

AC-7303 copper-clad laminate offers thermal conductivity of 3W/mK, a reported modulus 1/10 that of conventional materials, and flexible dielectric layer (after curing).

Read more: ToyoTech Offers AC-7303 Laminate

FAB 3000 v. 7 is CAM software runs advanced DRC/DfM verifications, generates component centroids, creates SMT stencil pads, panelizes PCBs, and performs other useful features.

Read more: Numerical Innovations Offers FAB 3000 v.7 CAM

RO4460G2 low-loss bondply has a 6.15 dielectric constant (Dk).

Read more: Rogers Introduces RO4460G2 Bondply

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