Xpeedic EDA 2023 Suite includes 2.5-D and 3-D signal integrity and power integrity simulation for advanced packaging, along with three platforms to support 3-D Electromagnetic simulation, multi-domain co-simulation and high-speed system simulation.
Keysight Technologies' PathWave Advanced Design System (ADS) 2024 is an electronic design automation software suite giving chip designers new millimeter wave and subterahertz frequency capabilities that accelerate 5G mmWave product design and anticipate requirements for 6G wireless communications development.
Xpeedic's RF Electronic Design Automation Solution includes XDS, Xpeedic’s RF system-level design and simulation platform, IRIS, its on-chip passive modeling and simulation tool, and iModeler, a passive model generation tool.
The latest release of ExpressPCB Plus layout software, version 3.2.0, brings improved performance and flexibility for designers.
Siemens' incorporation of the Supplyframe Design-to-Source Intelligence platform with the Xpedition software for electronic systems design facilitates supply chain resilience by providing real-time visibility into global component availability, demand, cost, compliance and associated parametric data at the point of design.
Stackpole’s RNCL thin film high power anti-surge chip resistors provide high power ratings per chip size with resistance values down to 50mΩ.