IsoPro 4.0 software edits and converts Gerber, Excellon Drill, and DXF files for use by the Quick Circuit prototyping system.

Read more: T-Tech Releases IsoPro 4.0 Rapid PT Software

Mezza-pede SMT connectors now include a lower profile DHAL header that reportedly reduces board stack height by 15%. Features 0.025" insulator. When paired with mating socket model DHS, a z-axis stack height of 0.132" is achievable. Facilitates a reduction in package height and a shorter signal path in applications ranging from tunable laser power connectors in optical transceivers to handheld medical electronics. For use in 1mm pitch board-to-board and cable-to-board interconnections in high-density electronic designs. DHAL is available with 14 positions and features SMT lead frame and pin design that combines high-reliability screw-machined terminals with over-molded lead frame in a precision-molded LCP insulator. Is RoHS compliant, usable at operating temperatures from -55° to +125°C; can handle up to 1.1A current at 80°C.

Advanced Interconnections Corp., www.advanced.com

 

RO4830 high-frequency laminates are processed by standard epoxy/glass (FR-4) circuit fabrication methods.

Read more: Rogers Launches RO4830 Laminates

ST-Line solder mask and dry-film pretreatment process equipment is fully compatible with CupraEtch pretreatment chemistry and reportedly boosts yields to control production costs.

Read more: Atotech Launches ST-Line Surface Prep Equipment