Bend Days
A bend radius lower than the recommended minimum merits a closer look. READ MORE...
The Experts' Take on AI
What’s working now and what’s not (but should be). READ MORE...
Are You Using Too Many Vias?
The answer is probably yes. READ MORE...
Designing for High-Pin Count Devices
Overcoming “anywhere but here.” READ MORE...
PCB Stack-up and Signal Integrity Fundamentals
How to order layers to achieve target impedance values. READ MORE...
Bluetooth Design
6 steps for limiting interference and data loss. READ MORE...
Component Land Patterns
A manufacturer’s perspective on determining parts layout. READ MORE...
Homepage Slideshow
A bend radius lower than the recommended minimum merits a closer look.
https://www.pcdandf.com/pcdesign/index.php/currenassue/243-flexperts/18757-beyond-the-bend-practical-guidelines-for-flex-and-rigid-flex-design
What’s working now and what’s not (but should be).
https://www.pcdandf.com/pcdesign/index.php/editorial/menu-features/18760-ai-in-electronics-manufacturing-what-s-working-now-what-s-not-but-should-be
The answer is probably yes.
https://www.pcdandf.com/pcdesign/index.php/editorial/menu-features/18713-are-you-using-too-many-vias
Overcoming “anywhere but here.”
https://www.pcdandf.com/pcdesign/index.php/current-issue/241-designer-s-notebook/18755-designing-for-high-pin-count-devices
How to order layers to achieve target impedance values.
https://www.pcdandf.com/pcdesign/index.php/editorial/menu-features/18759-fundamentals-of-pcb-stack-up-and-signal-integrity
6 steps for limiting interference and data loss.
https://www.pcdandf.com/pcdesign/index.php/editorial/menu-features/18758-bluetooth-circuit-board-design-guidelines
A manufacturer’s perspective on determining parts layout.
https://www.pcdandf.com/pcdesign/index.php/editorial/menu-features/18716-component-land-patterns-a-primer
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