2007 Issues

Asian control of cell phone and IC substrate production propels growth.

Read more: Consumer Electronics Reign Supreme

Lead-free assembly requires a balance between copper, base material and design to assure reliability.

Read more: The Impact of Lead-Free Processing on Interconnect Reliability

Immersion silver and high temperature OSPs meet the manufacturer’s goals of low cost and ease of use, and the assembler’s need for high first-pass yields and improved long term reliability.

Read more: Selecting the Right Final Finish for RoHS Compliant PCBs

OEM designers and their EMS partners should evaluate SerDes device characteristics and match them to known PCB design constraints to improve overall performance.

Read more: Selecting the Right SerDes Device
Dr. Eric Bogatin Read more: Calculating Characteristic Impedance
Dominique Numakura Read more: InterNepcon 2007 Recap

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