Written by Frando van der Pas, Yung-Herng Yau, Karl Wengenroth and Jim Kenny
Category: 2007 Issues
Immersion silver and high temperature OSPs meet the manufacturer’s goals of low cost and ease of use, and the assembler’s need for high first-pass yields and improved long term reliability.
Read more: Selecting the Right Final Finish for RoHS Compliant PCBs
OEM designers and their EMS partners should evaluate SerDes device characteristics and match them to known PCB design constraints to improve overall performance.