Design News

WILSONVILLE, OR – Mentor Graphics has released a power integrity analysis tool, HyperLynx PI, which according to the company provides easy-to-learn-and-use setup and accurate analysis of power plane structures.

Read more: Mentor Introduces Power Integrity Analysis for PCBs
PITTSBURGH – The Millennia Group Inc. (TMG) has named Pete Wasnac director of sales and marketing. He will report to Ron Cosper, president and COO.
 
Wasnac will be responsible for managing sales and marketing activities and supervising the sales representatives. He brings more than 20 years of experience in electronics distribution and manufacturing.
 
Prior to joining TMG, he worked for Avnet Electronic Marketing and Nielsen-Kellerman. He was also the general manager of operations at Arrow Electronics for 18 years.
SANTA CLARA, CA and TAMIL NADU, INDIA – Zero Defects International and Skyla Technologies have partnered to provide cost-effective Virtual CAM services for the PCB industry.
 
India-based Skyla will give job quotes, date input, pre-CAM, stack-up/impedance, DFM, panelization and custom scripting to companies. Zero Defects will be the exclusive distributor in North America.
 
Services are on a subscription or per-use basis to keep costs down and to maximize speed and efficiency.

CHICAGO– Electronic Interconnect Technology (EI) has added a full range of printed circuit fabrication data verification services to its menu.
 
Data verification allows users to sort out PCB design and DFM issues early in the design process to avoid production problems later.
 
“We run extensive DRC/DFM analysis on all incoming Gerber files, prototypes or production so that any issues or concerns that we find are quickly relayed to our customers,” explained Pratish Patel, president and CEO.
MAYNARD, MA – A paper written by Signal Integrity Software Inc. (SiSoft) and co-authored with Cisco Systems has been nominated as a Best Paper Finalist at DesignCon 2009.
 
“A Simple Via Experiment” presents an analytical model for understanding and predicting behavior of via structures, correlated to lab measurements. Theoretical, 3D field solver and measured data will be presented for an experimental via structure designed so that the experiment can be easily repeated.
 
Dr. Michael Steinberger of SiSoft will present the paper on February 3.
MUNICH, GERMANY and WESTFORD, MA – Zuken is offering a free download of CADSTAR 11 Schematic Design Tool until March 31.
 
As designs become more complex, the need for data transfer and communication between members of a design team is crucial. By providing a single design tool environment, Zuken anticipates users will be able to process designs quickly and at lower costs.
 
The software can be downloaded at www.zuken.com/CADSTAR, users will need to provide a MAC address to obtain a license.  

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