SANTA CLARA, CA – A group of leading companies in the semiconductor and printed circuit board design, fabrication and assembly industries will convene Sept. 28 at the Santa Clara Convention Center to discuss an exciting new solution to age-old electronics data transfer problems.

Read more: Industry Panel to Highlight Data Transfer Problems, Solutions at PCB West

BROOMFIELD, CO – Mentor Graphics will use Spatial's 3D software components in select PCB software products.

Spatial’s components aid in 3D modeling and analysis within Mentor's PCB systems design and mechanical analysis products.

Under the agreement, components included are 3D ACIS Modeler for wireframe and solids modeling; 3D InterOp for data exchange of parts and assemblies to/from MCAD systems; 3D Mesh toolkit for surface and volumetric meshing, and 3D Visualization framework. The inclusion enhances performance of full 3D design in the electronic domain and tighter integration with the mechanical domain.

MARLBOROUGH, MA – DownStream Technologies today announced official support of the new IPC-2581 electronics data transfer standard, having signed on as a founding member of the IPC-2581 Consortium in June.

Read more: DownStream Announces Support for IPC-2581

PITTSBURGH – Top 100 Research Foundation has named Ansys to its Software Top 100 list for the fifth straight year.

Read more: Ansys Moves Up in Software Sales List