BREA, CA – Additive Circuits Technologies appointed David Torp CEO, effective July 1.

Read more: Additive Circuits Appoints Torp CEO

SCHAFFHAUSEN, SWITZERLAND – TE Connectivity has signed a definitive agreement to acquire ERNI Group. The transaction is expected to close by the end of the current quarter, following the receipt of customary regulatory approvals. No financial terms were disclosed.

Read more: TE Connectivity to Acquire ERNI Group

SINGAPORE – A*STAR’s Institute of Microelectronics (IME) is collaborating with four companies to form a system-in-package (SiP) consortium, say reports. IME will team with Asahi-Kasei, Globalfoundries, Qorvo and Toray to develop high-density SiP for heterogeneous chiplet integration for 5G and other applications.

Read more: New Consortium to Develop SiP for Heterogeneous Chiplet Integration for 5G Apps

TAOYUAN CITY, TAIWAN – Supply and demand of raw materials continues to plague the industry. However, with the continued demand for high-performance computing and automotive electronics, and the stay-at-home economy resulting from the pandemic, revenue of listed Taiwanese PCB companies grew at an annual rate of 16.8% year-over-year in May, up 1.1% sequentially, according to the Taiwan Printed Circuit Association. Total revenue of listed PCB material-related companies grew to over 70% in the same month.

Read more: Taiwan PCB Revenue Up 17% in May