BANNOCKBURN, IL — Winners of the Best of Conference papers for IPC Apex Expo 2022 include the following:
- “Analysis of a Dynamic Flexed Flat Cable Harness” by Bhanu Sood, Ph.D., NASA Goddard Space Flight Center. Coauthors are Mary E. Wusk, Eric Burke, Dave Dawicke, George Slenski, NASA Langley Research Center; and Stephen Lebair, NASA Goddard Space Flight Center.
- “Microvia Reliability Testing Utilizing D-Coupons to Understand Best Design Practice” by Kevin Kusiak, Lockheed Martin.
- “A Critical Analysis of CAF Testing – Temperature, Humidity, and the Reality of Field Performance” by Kevin Knadle, TTM Technologies.
The NextGen best paper is awarded to “Bio-based Encapsulation Resins: Good for the Environment, Good for Your Environment” by Beth Turner, Electrolube.
Selected for the Student Research award is “Reliability and IMC Layer Evolution of Homogenous Lead-Free Solder Joints During Thermal Cycling” by Mohamed El Amine Belhadi, Ph.D. candidate, Auburn University. Coauthors are Xin Wei, Palash Vyas, Rong Zhao, Sa’d Hamasha, Haneen Ali, Jeff Suhling, Pradeep Lall, Barton C. Prorok, all with Auburn University.
Eight papers were selected in the honorable mention category:
- “Towards Artificial Intelligence in SMT Inspection Processes” by Mario Peutler, Continental Automotive. Coauthors are Michael Boesl, Johannes Brunner and Thomas Kleinert, Ph.D., Continental Automotive.
- “A Multiphase Model of Intermittent Contact in Lubricated Electrical Contacts” by Robert Jackson, Auburn University, coauthored by Santosh Angadi, Nitte Meenakshi Institute of Technology.
- "Electro-thermal-mechanical Modeling of One-Dimensional Conductors, Whiskers, and Wires Including Convection, and Considering Tin, Bismuth, Zinc and Indium” by Robert Jackson, Auburn University, coauthored by Erika R. Crandall, TE Connectivity.
- "Design and Testing of Three Levels of Microvias for High-Reliability PCBs” by Maarten Cauwe, Ph.D., imec-CMST. Coauthors are Jason Furlong, PWB Interconnect Solutions; Stan Heltzel, ESA-ESTEC; Marnix Van De Slyeke, ACB; Bob Neves, Microtek Changzhou Laboratories; and Kevin Knadle, TTM Technologies.
- “Recrystallisation and the Resulting Crystal Structures in Plated Microvias” by Roger Massey, Atotech. Coauthors are T. Bernhard, K. Klaeden, S. Zarwell, S. Kempa, E. Steinhaeuser, S. Dieter, F. Brüning, all with Atotech.
- “Defluxing of Copper Pillar Bumped Flip Chips” by Ravi Parthasarathy, coauthored by Umut Tosun, Zestron.
- “Reliability SoH Degradation and Life Prediction of Thin Flexible Batteries Under Flex-to-Install Dynamic Folding, Dynamic Twisting and Battery Lamination” by Pradeep Lall, Ph.D., Auburn University. Coauthors are Ved Soni, Jinesh Narangaparambil, Hyesoo Jang, Auburn University; and Scott Miller, NextFlex Manufacturing Institute.
- “Electromechanical Testing of Flexible Hybrid Electronics” by Mark Poliks, Ph.D., Binghamton University. Coauthors are Mohammed Alhendi, Behnam Garakani, Udara S. Somarathna, Gurvinder Singh Khinda, all with State University of New York at Binghamton.
The papers were voted on by members of the IPC Apex Expo 2022 Technical Program Committee.
All technical conference papers were evaluated on their technical content, originality, test procedures and data used to deduce conclusions, quality of illustrations and the clarity and professionalism of writing, as well as value to the industry.
“The TPC is absolutely focused on providing highest quality content to the technical conference,” said Matt Kelly, IPC chief technologist. “This commitment to quality is reflected in this year's selection of Best of Conference, NextGen, and Best Student Research papers. We extend our congratulations to all the award winners."
To register for IPC Apex Expo, visit www.IPCAPEXEXPO.org.
Register now for "Best DFM Practices for Board Engineers," a new three-hour webinar from Susy Webb, CID. Coming Feb. 22. www.pcb2day.com
