BEAVERTON, OR – Advanced Semiconductor Engineering, AMD, Arm, Google Cloud, Intel, Meta, Microsoft, Qualcomm, Samsung and Taiwan Semiconductor Manufacturing formed a consortium to establish a die-to-die interconnect standard and foster an open chiplet ecosystem.

Read more: Industry Leaders Establish Universal Chiplet Interconnect Spec

TAIPEI – Nan Ya Printed Circuit Board reported sales of NT$4.12 billion ($146.8 million) in February, up 34% year-over-year and down 21% sequentially.

Read more: Nan Ya PCB Reports Feb. Sales Up 34%

SANTA ANA, CA -- TTM Technologies will invest $130 million in a new, state-of-the-art, highly automated printed circuit board manufacturing facility in Penang, Malaysia, in response to customers’ increasing concerns about supply-chain resiliency and regional diversification, and the need for advanced multilayer PCB sourcing options in lower-cost regions.

Read more: TTM to Build New Automated PCB Fab in Penang

STOCKHOLM – NCAB Group’s board of directors decided to halt all deliveries of printed circuit boards to Russian customers effective immediately, whether or not affected by sanctions.

Read more: NCAB Halts Delivery of PCBs to Russia