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TAIWAN - Tripod Technology plans to double its capacity in the notebook PCB segment, in order to keep pace with expected increase in demand.

Tripod has designated its plant 4A at Wuxi, China for notebook PCB production. The company’s current 500,000 sq. ft. capacity will be increased to 800,000 sq. ft. in the third quarter, and to one million by the end of 2008, according to company plans.

As of 2007, Tripod shipped a total of 10 million notebook PCBs, for a market share of 8%. Notebook PCB production contributed about 12% to company sales in 2007. Investors estimate that Tripod will ship a total of 12-15 million notebook PCBs in 2008, and company executives indicate that Tripod will attempt to increase their notebook PCB market share to 10%.

ENDICOTT, NY - Endicott Interconnect Technologies, Inc. (EI) honored 32 employees for patent applications filed, 23 employees for US patents issued, and 16 employees for supplying trade secrets in a ceremony held February 8th. EI employees contributed a total of 29 US patent application filings, 18 US patents issuances and 5 trade secrets in 2007.

Patents were awarded to: Tim Antesberger, Ash Bhatt, David Caletka, Varaprasad Calmidi, Norman Card, Rabindra Das, Subahu Desai, Robert Edwards, Frank Egitto, James Fuller, Robert Japp, John Konrad, John Kresge, John Lauffer, How Lin, Roy Magnuson, Voya Markovich, Luis Matienzo, James McNamara, Kostas Papathomas, Steven Rosser, William Wilson, and Michael Wozniak.

Trade Secrets were awarded to: Norman Card, Benson Chan, Subahu Desai, Kevin Haughan, Robert Japp, John Konrad, John Kresge, How Lin, Luis Matienzo, Thomas Miller, Susan Pitely, Rajinder Rai, Ronald Smith, Duane Stanke, Daniel Van Hart, and Robert Whitehouse.

“The dedication, efforts and achievements of these individuals in the technology arena are exemplary,” commented James J. McNamara Jr., EI President and CEO. “Our research, development and engineering personnel are instrumental to EI by allowing us to meet challenges head on.”

“I am very proud of the scientists and engineers who have contributed to the success of EI through technology innovation. They are making a significant difference in our Company and I congratulate and thank them,” said Voya Markovich, EI Senior VP and CTO.

The Fifth Annual Patent Recognition Dinner recognizes employees for their contributions to the company. The team at EI has filed 98 US patent applications and 48 have been awarded to date.

RENFREWSHIRE, UK - Teknek has reportedly concluded arrangements with SDI, and the company reports that the two parties have reached an amicable settlement.

In a press release, Teknek has reported that the company will spearhead a new campaign to significantly grow its US presence.

According to the release, Teknek will open three facilities within the next few weeks, with one based in the US. "To ensure a truly global service we are developing three fulfilment centers, one in the USA, one in Europe and the other in our Hong Kong facility." commented Teknek CEO Stephen Mitchell.

The company reports that it will launch a new Surface Mount Clean Machine designed to improve yields in EMS applications. "Our new Surface Mount machine has some unique design features, but its most important feature is its performance. Major customers report as much as an 80% reduction in Tomb stoning - that’s payback within months," reports Mitchell. According to the company, its operations have recently adopted the Lean Thinking philosophy, and the company's Surface Mount Clean Machine will reportedly be available on a 10 day lead time.

SEOUL, KOREA - LG Electronics has announced that its board has approved an agreement to exchange LG Electronics' PCB division with its affiliate LG Micron's plasma rear panel division. This restructuring agreement will reportedly improve efficiency and raise equity for both companies.

According to the agreement, the transfer and acquisition will take place on May 1 and will include assets, liabilities and human resources. Accounts receivable, accounts payable, and some real estate will be excluded.

LG Electronics sites the increased efficiency and cost effectiveness of producing both plasma display panels and rear panels together as its reason for the move. LG Micron will reportedly boost its efficiency as well, by producing components in house, once it acquires LG Electronics’ PCB division.

LG Electronics is the largest stockholder of LG Micron. This agreement will increase LG Electronics’ stake in the LG Micron from 36% to 55%t.

On May 1, LG Electronics will transfer $141.1 million of assests to LG Micron, which includes two PCB manufacturing facilities in Chungju and Osan, Korea, as well as property, equipment and machinery.

The agreement will be brought before shareholders of LG Electronics and LG Micron at respective shareholder meetings for approval.