Fab News

LONDON -- Cookson Group today raised its fiscal first-half revenue and profit outlook on better-than-expected demand across many business sectors, including electronics.

The metals conglomerate said first-half revenues would be 25% to 27% higher than last year. It forecast earnings of 110 million and 115 million pounds, up from 17 million pounds in 2009.

Cookson said the electronics market outlook for the second half also was strong.  

CHENGDU, CHINA -- MFlex's local subsidiary has signed a deal to begin construction on a printed circuit board manufacturing facility here, a project expected to be finished by January 2011.

Read more: MFlex Commits to Chengdu PWB Site

WASHINGTON – “Manufacturers are pleased the administration is moving forward with changes to modernize the current Cold-war era system. We are particularly encouraged by the announcement of a single control list and a unified information technology platform, but we believe the administration must also move forward on near- and medium-term reforms along the way to creating a single agency.”

So said Frank Vargo, the National Association of Manufacturers’ VP for international economic affairs, in a prepared response to Defense Secretary Robert Gates’ speech on the administration’s export control reform proposals.

In the press statement, Vargo added, “The creation of a new agency to administer a modern export control regime will only be a success if it includes the implementation of a workable transition plan and near- and medium-term reforms.”

The NAM proposed near- and medium-term recommendations earlier this year, along with a blueprint for fundamental reform, Vargo continued. He believes these reforms are critical to addressing immediate national security, industrial base, and manufacturing imperatives.

Manufacturers had hoped the administration’s proposals would include details about “implementation of the intra-company transfer, a renewed focus on small- and medium-sized manufacturers, and a streamlined approach for licensing to support US government programs involving allies.”    

The NAM will “continue to urge implementation of near- and medium-term reforms, while working toward a fundamental makeover of the system” to “enhance US national security, support the industrial base and reach the president’s goal of doubling exports within five years.”

BANNOCKBURN, ILIPC has released IPC-4202A, Flexible Base Dielectrics for Use in Flexible Printed Circuitry. The revised standard provides data to help determine the capability and compatibility of flexible base dielectric materials in manufacturing flexible printed circuitry and flexible flat cables.
Read more: IPC-4202 Revision Provides Guidance in Flexible Base Dielectric Materials
LAS VEGASIPC announced the 2010 Best Industry Posters and the winners of the second annual IPC Academic Poster Competition at Apex Expo.
   
Tied for first place were Christopher Hunt, Ph.D., National Physical Laboratory, for “Solder Joint Reliability from Material Properties,” and David Lee, Ph.D., Johns Hopkins University, for “Comparison of the Electrochemical and Physical Properties of the Nanocrystalline Copper Deposition in the Fabrication of Wiring Boards.”

From twenty–three industry posters presented, the event’s Technical Program Committee selected the winners through a ballot process.

IPC also held an academic poster competition. Attendees voted on the top three posters, with first place going to Pylin Sarobol, Aaron Pedigo, P.Su, J.E. Blendell, and C.A. Handwerker, Sc.D., from Purdue University for “A Defect Phase Diagram for Tin Whisker and Local Film Properties near Whiskers.”

The same team, with Aaron Pedigo as the main author, took second place for “Tin Whisker Growth Related to the Crystallographic Texture of Sn and Sn Alloy Electrodeposits.”

Amendra Koul from Missouri University of Science and Technology won third place for “Thermal Effects on PCB Laminate Material Dielectric Constant and Dissipation Factor.”

Ten posters highlighting research being conducted at the college level were featured from Auburn University; Missouri University of Science and Technology; Purdue University; University of California, Irvine, and University of Maryland.

ST. LOUISViasystems Group Inc. has appointed Peter Frank, president of GSC Group, to its board of directors.

Read more: Viasystems Names GSC Group President Frank to Board

Page 526 of 711