TAIPEI -- Foxconn Electronics will boost its investment in its components and PCB sites in China by an additional $349 million and will issue a series of bonds to pay off debt, according to reports.

The EMS behemoth will issue up to $395 million in unsecured convertible bonds to underwrite the costs and pay off short-term loans, DigiTimes reports.

The funds will be used to enhance its manufacturing sites for tablet PCs, handsets, components, and printed circuit boards.

Foxconn in October said it would invest some $260 million in the subsidiaries.

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