SHENZHEN, CHINA – The 2016 International Printed Circuit & Apex South China Fair (2016 HKPCA & IPC Show) will take place here Dec. 7-9.

Read more: 2016 HKPCA & IPC Show Comes to Shenzhen Dec. 7-9

CAVE CREEK, AZ -- The High Density Packaging (HDP) User Group announced a new project studying the impact of moisture on high-frequency measurements of printed circuit board material.

Read more: New Study to Test Moisture Effects on Substrate Material Performance

CUPERTINO, CA – For years, R&D specialists have been working on carbon nanotubes as a means for electronic interconnection.

Read more: Carbon Nanotube Patent May Portend More Moldable Electronics

MIGDAL HAEMEK, ISRAEL – Camtek reported third quarter revenue was $28.5 million, up 8% year-over-year and 4% sequentially.

Read more: Camtek’s Q3 Revenue Up 8%