WASHINGTON -- By challenging the technology community to integrate the collective functions hosted by an entire PCB onto a device approaching the size of a single chip, DARPA’s newest program is making a bid to usher in a fresh dimension of technology miniaturization.

Read more: Another Big Shrink: Tiling Chiplets into Next-Generation Microsystems

SOUTH NORWALK, CT -- Cable and connector firm Winchester Electronics has been acquired by private equity firm Snow Phipps for an undisclosed sum. 

Read more: PE Firm Buys Connector Maker Winchester Electronics

AUSTIN, TX – Fan-out wafer level packaging (FO-WLP) continues to show growth momentum, says TechSearch, with multiple parts found in Samsung’s Galaxy phones and many packages expected in Apple’s next iPhone. Companies are researching large area panel processing as a result of constant pressure to lower cost.

Read more: TechSearch Addresses FO-WLP Panel Processing Challenges in New Report

SUZHOU, CHINA – Seica Electronics has doubled its local technical support team in the first half and expects to expand further in the near future.

Read more: Seica Doubles Tech Support in Suzhou