CAVE CREEK, AZ -- The High Density Packaging (HDP) User Group announced a new project studying the impact of moisture on high-frequency measurements of printed circuit board material.

As electronic products increase in functionality and interconnect speeds approach 40Gb/s, the need to measure substrate material performance becomes increasingly important and demanding, HDP says. During prior testing and analysis by the consortium members, it was determined that differences in moisture content were found to contribute up to a 20% difference in the measured dissipation factor (Df) values of some laminate materials tested. The current project proposes to evaluate the effect of moisture on a series of high-frequency dielectric constant (Dk) and Df test methods that were established in the previous phases of the study.

This is the third project in this series. Phase 3 will use several laminates, including low Df, mid Df, and high Df types.

Phase one reviewed and compared the different types of high frequency test measurements that are used in the industry for measuring Dk and Df at higher frequencies. 

Phase 2 was initiated to establish a test protocol for the accurate measurement of Dk, Df, and weight gain. Weight gain is used to measure moisture content. The objective of Phase 2 was only to establish a test protocol to accurately measure weight to 4 decimal places.

HDP named Jack Fisher to coordinate the work; This email address is being protected from spambots. You need JavaScript enabled to view it..

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