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ARLINGTON, VA – The Defense Advanced Research Projects Agency provided Northrop Grumman's Electronic Systems a $1.7 million contract to develop an ultra high capacity hybrid thermal ground plane to fight semiconductor-generated heat employed in electronic systems.

The 18-month contract follows a $1.5 million contract awarded earlier this year to the University of Colorado, Boulder and Lockheed Martin to work on comparable technology.

Together, both contracts eventually could be worth about $10 million, says the agency, provided all phases are completed.

These agreements come on the heels of a recent Navy report predicting shipboard cooling requirements would double every six years for the next 20 years.

BANNOCKBURN, IL – IPC will hold a conference on November 6 at the Wyndham Hotel DFW, Irving, TX, to discuss the details of the IPC-9592 power conversion standard: Requirements for Power Conversion Devices for the Computer and Telecommunications Industries.

The meeting will outline the process and input that went into developing this first-ever power conversion standard, which is in its final stages. The conference agenda will cover power conversion product attributes, including product specifications and document requirements; design for reliability; design and qualification testing, and manufacturing conformance testing.

The committee members for the standard will present the sessions. These volunteer members – representing Alcatel-Lucent, Cisco Systems, Dell Inc., Emerson Network Power, Hewlett-Packard Co., IBM, Lineage Power and Murata Power Solutions – will describe the logic used to craft each chapter.

For more information, visit www.ipc.org/9592conference.