Printed Circuit Design & Fab Online Magazine - News

News

ATLANTA – UP Media Group Inc., parent company of Printed Circuit Design & Manufacture, announced Joseph Fjelstad, founder and president of Verdant Enterprises, will deliver the keynote address at PCB Design Conference East 2007 in Durham, NC, on Oct. 23, at 11 a.m. in the Durham Marriott at the Civic Center.

Fjelstad’s keynote, titled "Robust Environmentally Friendly Electronics Assembly," will reveal a new electronics assembly process said to use no solder – eliminating many of the risks and reliability exposures associated with lead-free solders – and no conventional circuit boards.

The Reverse Interconnection Process embodies a new sequence of core processing technologies, and is achieved through direct copper-copper plate-up onto an inverted cast-in-place component-array platform. The process has demonstrated the conceptual potential for the manufacture of high-density, high-performance, high-reliability and environmentally (i.e., RoHS) compliant solutions for products ranging from consumer to mil-aero applications.

Founder and president of Verdant Electronics, Fjelstad has more than 35 years of experience in electronics interconnection and packaging in a variety of capacities, from chemist to process engineer and from international consultant to CEO.

The keynote is free to attend; however, registration and a badge are required for admission. To register online or find out more about the Oct. 21-26 show, visit www.pcbeast.com.

UPMG's 2008 conferences include PCB East 2008 on May 11-16 at the Holiday Inn Select & Convention Center in Tinley Park, IL, and PCB West 2008 on September 14-19 at the Marriott Santa Clara in Santa Clara, CA.

SHANGHAI – PCB producer AT&S has started to equip its third plant in Shanghai.

Operations at AT&S’s first plant in Shanghai began in 2002; the second plant now is also completely operational.

The company is currently ramping up its third production line, completing the second plant as initially planned, AT&S reports. Based on the trend toward more complex PCBs, the company also plans to install an additional fourth line, which will be completed in November.

Simultaneously, the company will put the third plant into operation. Necessary investments into equipment have been made, and capacities out of this plant will be available in the fourth quarter, says the company.

The first plant has an area of 25,000 m². A second 75,000 m² building next door has been divided into plants two and three.

All three plants are set up for mass production of highly complex laser-drilled HDI PCBs, says the AT&S.

CEO Harald Sommerer says AT&S will be able to grow 15% within the year.