News

WEST HAVEN, CT -- Enthone Inc. has begun construction on a plating applications laboratory here, with a operations scheduled to begin in September.

The site will evaluate and validation Enthone processes prior to beta-site field testing, conduct training and process capability demonstrations, identify and implement processing methodologies, and perform collaborative plating work with key customers.
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SUNNYVALE, CA – A new “reverse order” interconnection method describes a way to produce a finished electronics assembly with neither solder nor a circuit board. The method, tentatively called the “Occam Process,” is a way to build an electronics assembly using mature core processing technologies in a novel sequence.

What’s more, says the inventor, the end-product is expected to be more reliable than previous solder-free strategies (e.g., using conductive adhesive as a solder substitute) or traditionally manufactured soldered assemblies.

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