ENDICOTT, NY and CHELMSFORD, UK – Endicott Interconnect Technologies Inc. (EI) has named Steve Payne director of European sales for EI Technologies UK Ltd. He will manage the newly formed UK office and oversee account penetration for specific targets within the European market. EI’s European manufacturing representatives will report directly to him.
 
Payne brings over 30 years of experience in the global electronic packaging industry. Prior to joining EI, he was the divisional manager for GEC Marconi Research and managing director of Cirflex Technology Ltd.

SAN JOSE, CA and OWEGO, NY – In November, Sanmina-SCI Corporation cut about 110 jobs at its printed circuit board facility in Owego, citing the dwindling economy and a slump in product demand. The layoffs included both temporary and permanent workers.