News

BEAVERTON, OR – Advanced Semiconductor Engineering, AMD, Arm, Google Cloud, Intel, Meta, Microsoft, Qualcomm, Samsung and Taiwan Semiconductor Manufacturing formed a consortium to establish a die-to-die interconnect standard and foster an open chiplet ecosystem.

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TAIPEI – Nan Ya Printed Circuit Board reported sales of NT$4.12 billion ($146.8 million) in February, up 34% year-over-year and down 21% sequentially.

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