BEAVERTON, OR – Advanced Semiconductor Engineering, AMD, Arm, Google Cloud, Intel, Meta, Microsoft, Qualcomm, Samsung and Taiwan Semiconductor Manufacturing formed a consortium to establish a die-to-die interconnect standard and foster an open chiplet ecosystem.

The organization, representing a diverse ecosystem of market segments, will address customer requests for more customizable package-level integration, connecting best-in-class die-to-die interconnect and protocols from an interoperable, multi-vendor ecosystem.

The founding companies ratified the Universal Chiplet Interconnect Express (UCIe) specification, an open industry standard developed to establish a ubiquitous interconnect at the package level, now available for members as a download.

The specification provides a standardized die-to-die interconnect with physical layer, protocol stack, software model and compliance testing to enable end users to mix and match chiplet components from a multi-vendor ecosystem for System-on-Chip (SoC) construction, including customized SoC.

The UCIe 1.0 specification covers the die-to-die I/O physical layer, die-to-die protocols and software stack that leverage the PCI Express (PCIe) and Compute Express Link (CXL) industry standards.

To become a member, contact This email address is being protected from spambots. You need JavaScript enabled to view it..

Register now for PCB East, the largest electronics technical conference and exhibition on the East Coast. Coming in April to Marlboro, MA.

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