ARAYA, THAILAND – Doosan is investing approximately $135 million to establish a new production base for copper clad laminates (CCL), a key material used in printed circuit boards, as global AI infrastructure demand accelerates.
FREUDENSTADT, GERMANY – Schmid has introduced its Any Layer Embedded Trace (ET) process, a panel-level manufacturing platform designed to support next-generation advanced packaging as AI and high-performance computing drive increasing substrate complexity.