SINGAPORE – A*STAR’s Institute of Microelectronics (IME) is collaborating with four companies to form a system-in-package (SiP) consortium, say reports. IME will team with Asahi-Kasei, Globalfoundries, Qorvo and Toray to develop high-density SiP for heterogeneous chiplet integration for 5G and other applications.

TAOYUAN CITY, TAIWAN – Supply and demand of raw materials continues to plague the industry. However, with the continued demand for high-performance computing and automotive electronics, and the stay-at-home economy resulting from the pandemic, revenue of listed Taiwanese PCB companies grew at an annual rate of 16.8% year-over-year in May, up 1.1% sequentially, according to the Taiwan Printed Circuit Association. Total revenue of listed PCB material-related companies grew to over 70% in the same month.