Market News

MALMO, SWEDEN, Obducat AB and Canon Marketing Japan have announced an exclusive distribution agreement to market Obducat's products in Japan.

"We are very happy and honored to be associated with a world technology leader such as Canon. Canon Marketing Japan is well-established in the Japanese Semiconductor Equipment Market and the perfect partner for us to market our lithography solutions in Japan, essential in the industrialization of Obducat's NIL technology," says CEO Patrik Lundström.

"The Canon Marketing Japan and Obducat cooperation has developed very well over the last few months and we are therefore very pleased to have been appointed distributor of Obducat´s world leading products in Japan, says Hiroshi Shibuya, Managing Director of Canon.


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KOKOMO, IN - Richard D. Parker, lead technologist for advanced assembly technologies at Delphi Electronics & Safety Division has co-edited a book on lead-free electronics. Released in October 2007, the book, Entitled Lead-Free Electronics: iNEMI Projects Lead to Successful Manufacturing, is based on a six-year study on lead-free electronics, and covers issues surrounding the implementation of lead-free solder into electronic assembly boards.

"We are especially proud to have Rich as one of the co-editors of this new book" said Bob Schumacher, Delphi Electronics & Safety director of Advanced Product & Business Development. "His work on lead-free solder is a pivotal piece in our vision to keep our products and processes focused on being environmentally friendly"

The book features contributions from several hundred researchers at more than 100 companies, universities and government agencies. It includes chapters by industry experts on lead-free processing and covers topics such as solder material properties, reliability testing, lead-free rework and tin whisker mitigation.

"Rich has been a valuable contributor to iNEMI’s lead-free initiatives" said Jim McElroy, CEO of iNEMI. "He was not only instrumental in the publication of this book, but also in the work described by the book. His leadership and vision have been, and continue to be, integral to iNEMI’s successes in this area."

Parker serves as the chair of the iNEMI (International Electronics Manufacturing Initiative) Tin Whisker Project, Phase II. Numerous electronic system failures have been attributed to short circuits caused by tin whiskers that bridge closely-spaced circuit elements. Parker’s team focuses on identifying the root causes of whiskers to minimize the risk of system failures.

Parker received a bachelor of science degree from the former General Motor’s Institute in 1975 and has served in various engineering assignments at Delphi Electronics & Safety Division in Kokomo, Indiana.
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IRVINE, CA — Delphi Connection Systems will display its electronic enclosures, flexible circuit assemblies, bump flex assemblies, fiber optics and electrical connectors at the Western Conference and Exposition (West 2008) in San Diego on February 5 through 7.

"We're excited about the opportunity to showcase our world-class manufacturing practices and our knowledge of electrical and electronic architecture at one of the most important trade shows of its type," said Ric Franzi, GM of Delphi. "Our customers, especially in the military market [and] the aerospace and commercial markets, require rugged products that can perform in extremely harsh environments. Delphi is dedicated to meeting those requirements."

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