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  • How to Run a Design of Experiments

    How to Run a Design of Experiments

    A review of the six fundamental steps behind scientific process development.
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  • American Standard Circuits’ Push for UHDI is On

    American Standard Circuits’ Push for UHDI is On

    After new technology investments, the flagship operation of the Chicago-based fab is primed for growth.
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  • Collaborating Across the Industry

    Collaborating Across the Industry

    The High Density Packaging User Group drives innovation through active partnerships.
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  • Semi-Flexible PCBs: Flexibility without the Polyimide Price Tag

    Semi-Flexible PCBs: Flexibility without the Polyimide Price Tag

    Why a relatively unknown technology might be right for static bend applications.
      READ MORE...

  • Embedded Sensors in Flex Circuits

    Embedded Sensors in Flex Circuits

    From glob top to lamination, solutions for sealing parts in flex.
      READ MORE...

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Fab News

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Category: Fab News
ROGERS, CT – Rogers Corp. reported third-quarter net earnings from continuing operations fell 48% to $8.95 million on a 9.8% drop in net sales to $110 million. Sales exceeded company’s guidance, on strong demand for foams, high frequency circuit materials and power distribution systems, and one-time gains.  Read more ...

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Category: Fab News
SANTA ANA, CA – The Santa Ana trade winds couldn’t slow down TTM Technologies in the third quarter. The PWB fabricator roared to a 32% year-over-year gain in net income to $8.2 million as gross margins rose 100 basis points to 19.2%. Read more ...

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Category: Fab News
SAN JOSE, CA – At the First Occam Process Developers Meeting on Oct. 17, the first three agreements for the development of the Occam process were established. 

Companies committing to develop processes and work with interested OEMs to produce Occam products include microelectronics assembly company Promex Industries, PCB fabricator Micropress, and Hunter Technology Group.
 
Dick Otte, president of Promex stated, “We are just completing our first set of Occam process manufacturing runs … we’re excited about joining our Occam Process partners … and utilizing Occam to broaden our microelectronic assembly services.”
 
“We want to be the Occam Process leader in South America,” said, Gilmar Aparecido de Souza, president of Micropress, located in Sao Paulo, Brazil. “With over 2,000 customers in Brazil and throughout South America, we want to drive the Occam Process into our market … we will have our first Occam Process ‘fabsemblies’ completed within a few months.”

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Category: Fab News
HELSINKI – Pertti Vuorinen, currently CFO Asia-Pacific, has been called as new CFO for the Aspocomp Group Oyj, effective today. Vuorinen held the position from 1999 to 2006.
 
Aspocomp Group’s current CFO, Tapio Engström, will move to a new role outside the Group.
 
The Aspocomp Group develops interconnection solutions and supplies PCBs for mobile data terminal equipments, data communications networks and the automotive industry.

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Category: Fab News
ANAHEIM, CA – DDi Corp., provider of PCB engineering and manufacturing services, reported third-quarter net sales were $43.3 million, a decrease of 12% sequentially and essentially flat with sales in the third quarter of 2006.

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Category: Fab News
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