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  • How to Run a Design of Experiments

    How to Run a Design of Experiments

    A review of the six fundamental steps behind scientific process development.
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  • American Standard Circuits’ Push for UHDI is On

    American Standard Circuits’ Push for UHDI is On

    After new technology investments, the flagship operation of the Chicago-based fab is primed for growth.
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  • Collaborating Across the Industry

    Collaborating Across the Industry

    The High Density Packaging User Group drives innovation through active partnerships.
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  • Semi-Flexible PCBs: Flexibility without the Polyimide Price Tag

    Semi-Flexible PCBs: Flexibility without the Polyimide Price Tag

    Why a relatively unknown technology might be right for static bend applications.
      READ MORE...

  • Embedded Sensors in Flex Circuits

    Embedded Sensors in Flex Circuits

    From glob top to lamination, solutions for sealing parts in flex.
      READ MORE...

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Fab News

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Category: Fab News
ST. LOUIS, MO and OAK CREEK, WI – Viasystems Group Inc. has announced that it will close its Oak Creek manufacturing and distribution plant next year. The closure will take place in phases, with nearly 240 employees affected. The first, and largest, phase of layoffs is planned for January 19, and the final round is scheduled for May 31.

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Category: Fab News
CHANDLER, AZ – Isola USA Corporation has settled its complaint against Iteq Corporation. In October, Isola had filed a complaint with the United States International Trade Commission regarding the unlawful importation of certain prepregs, laminates and printed circuit boards (PCBs) that infringed on the company’s patents. 
 
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Category: Fab News
ANAHEIM, CA -- Multi-Fineline Electronix, Inc. announced that it has agreed to acquire Pelikon Limited. Pelikon, a privately-held company, is working on the development of printed segmented electroluminescent (pSELTM) displays and keypads. 
 
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Category: Fab News
BEAVERTON, OR-- Merix Corporation announced the completion of an expansion and technology upgrade to the Huiyang, China (HY) factory.

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Category: Fab News
YAVNE, ISRAEL -- Orbotech Ltd. today released a statement saying the company is "actively engaged in negotiations" with Fin.Pro S.p.A over the sale of its European and American assembly AOI business.

Orbotech's chief executive said the company hopes a sale can be reached quickly "to minimize disruption to our existing client base, while providing a clear path for our customers to continue to receive best-in-class solutions and professional service in the future.”

Italy-based Fin.Pro is the parent company of Prodele, Prodelectronic, Neutec Electronic and Prodelec North Africa. The companies are longtime partners of Orbotech, the latter said in a statement.

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Category: Fab News
MIGDAL HAEMEK, ISRAEL -- Camtek Ltd. announced results for the third quarter ending September 30, 2008. Revenues for Q3 2008 were $19.1 million, 5% below $20.2 million in Q3 2007 and 16% below the $22.7 million reported in the Q2 2008.

Gross profit in the 2008 third quarter was $6.5 million, or 34.2% of revenues, and included an inventory write-off of $1.5 million. Camtek reported a third quarter net loss of $4 million, or $0.14 per share.

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