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  • How to Run a Design of Experiments

    How to Run a Design of Experiments

    A review of the six fundamental steps behind scientific process development.
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  • American Standard Circuits’ Push for UHDI is On

    American Standard Circuits’ Push for UHDI is On

    After new technology investments, the flagship operation of the Chicago-based fab is primed for growth.
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  • Collaborating Across the Industry

    Collaborating Across the Industry

    The High Density Packaging User Group drives innovation through active partnerships.
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  • Semi-Flexible PCBs: Flexibility without the Polyimide Price Tag

    Semi-Flexible PCBs: Flexibility without the Polyimide Price Tag

    Why a relatively unknown technology might be right for static bend applications.
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  • Embedded Sensors in Flex Circuits

    Embedded Sensors in Flex Circuits

    From glob top to lamination, solutions for sealing parts in flex.
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Fab News

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Category: Fab News
MELVILLE, NY -- Park Electrochemical reported third-quarter sales fell 23% to $49.2 million for the period ended Nov. 30. Net earnings were down 67% year-over-year to $2.9 million.

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Category: Fab News
ENDICOTT, NY – Endicott Interconnect Technologies Inc. (EI) has received AS9100 certification. The company received a score of 100%.
 
AS9100 is the international quality management standard for designers and manufacturers of equipment for aerospace applications. “This certification strengthens EI’s competitive position as a world-class supplier of innovative advanced packaging solutions to this industry,” said K. Bradley Van Brunt, vice president of quality and business excellence. 

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Category: Fab News
COLERAINE, UK – AVX Ltd., a supplier of ceramic capacitors to the global electronics market, has announced that it will cut 92 jobs before Christmas. The company cites the loss of nearly one-quarter of its employees on a decrease in orders due to the weakening economy.

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Category: Fab News
ENDICOTT, NY and CHELMSFORD, UK – Endicott Interconnect Technologies Inc. (EI) has named Steve Payne director of European sales for EI Technologies UK Ltd. He will manage the newly formed UK office and oversee account penetration for specific targets within the European market. EI’s European manufacturing representatives will report directly to him.
 
Payne brings over 30 years of experience in the global electronic packaging industry. Prior to joining EI, he was the divisional manager for GEC Marconi Research and managing director of Cirflex Technology Ltd.

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Category: Fab News
SAN JOSE, CA and OWEGO, NY – In November, Sanmina-SCI Corporation cut about 110 jobs at its printed circuit board facility in Owego, citing the dwindling economy and a slump in product demand. The layoffs included both temporary and permanent workers.
 
According to the New York Labor Department, the company recently cut an additional 50 jobs, leaving about 540 workers at the plant. Sanmina’s future may not be as bleak as it seems, though. The company plans to rent additional space at its manufacturing facility in Salo, Finland.

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Category: Fab News
CHANDLER, AZ and FREMONT, CA – In an attempt to align output with the slumping North American market, Isola announced that it is closing its Fremont, CA facility on February 18, 2009. The company’s three remaining plants will continue to service customers.
 
“This is a very unfortunate event,” said Matt LaRont, president. “We have no option but to respond accordingly to what the market has done and what we think the outlook is into 2009.”

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