TAOYUAN, TAIWAN – Compeq Manufacturing reported a 12% year-over-year decrease in annual revenue, totaling NT67.1 billion ($2.1 billion).

TOKYO – Toppan Holdings will build a semiconductor package substrate plant in Singapore, with plans to begin operations at the end of 2026.

QINGYUAN, CHINA – Chinese PCB fabricator Jinlu Electronics has begun construction on a 2.3 billion yuan ($320 million) expansion project that will add an additional 3 million sq. m. of production capacity for multi-layer rigid boards and high-density interconnect boards.

ARLINGTON, VA – JEDEC has published JESD239 Graphics Double Data Rate (GDDR7) SGRAM, which offers double the bandwidth over GDDR6, reaching up to 192 GB/s per device, and is poised to meet the escalating demand for more memory bandwidth in graphics, gaming, compute, networking and AI applications.