Fab News

CHANGZHOU, CHINA – PCB chemicals manufacturer Orchem plans to invest $50 million to establish its China headquarters here.

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AUSTIN, TX – The high cost of moving to the next semiconductor technology node is changing the role of packaging and assembly in the electronics industry, says TechSearch International. Heterogeneous integration has become the solution to achieve the economic advantages that were previously met with silicon scaling.

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HSINCHU, TAIWAN – A new SEMI task force seeks to establish quality requirements spanning the supply chain to meet new, higher reliability standards and help safeguard Taiwan’s competitive edge in the global microelectronics industry.

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CHANDLER, AZ -- Rogers Corp. is planning additional capacity increases as it ramps its ability to meet expected demand for 5G and electric vehicles.

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NESS ZIONA, ISRAEL – Nano Dimension has received approval from the US and Korea Patents and Trademark Offices for the company’s core technology of its dielectric ink.

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BANNOCKBURN, IL – Data on OEMs’ use of emerging technologies showed more than half of those surveyed are currently making products that communicate with the Internet of Things, and 75% make products that depend on sensor inputs, according to IPC’s new global study, PCB Technology Trends 2018.

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