Fab News

BANNOCKBURN, ILIPC bestowed its highest corporate honors on Raytheon Co. and DuPont yesterday, citing the firms for their contributions to the trade group.

IPC awarded Raytheon the Stan Plzak Corporate Recognition Award, while DuPont received the Peter Sarmanian Corporate Recognition Award.

The Stan Plzak Award is presented to a firm that has taken initiative to actively contribute to enhancing the industry, while demonstrating support of IPC through participation in technical and/or management programs. This award is named after a former board chairman, who was a founding member of the IPC Electronics Manufacturing Services Industry Management Council.

Raytheon has been an IPC member since 1971 and currently has 18 member facilities. Seventy-seven Raytheon employees actively serve on IPC standards development committees, with seven employees serving as committee chairs, vice chairs or co-chairs.

Named for another former IPC board chairman, the Peter Sarmanian Corporate Recognition Award honors an IPC corporate member PCB industry that has taken a leadership role and made contributions to the industry, while demonstrating support of IPC through participation in technical and/or management programs.

DuPont has been an IPC member since 1964 with three member facilities. Some 30 DuPont employees hold a total of 81 committee memberships, and three employees currently serve as committee chairs or vice chairs.

SANTA ANA, CATTM Technologies has completed its acquisition of Meadville Holdings’ PCB businesses.

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TORONTO -- Printed circuit board maker Firan Technology Group reported first-quarter revenue fell 29% from a year ago on slower demand and currency exchange issues. Read more ...

LAS VEGAS – PCD&F today announced the winners of the 2010 New Product Introduction Award for PCB design and fabrication.

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SAN JOSE --  A group of Silicon Valley semiconductor veterans today announced a new direct-write digital imaging technology for printed circuit board production.

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BANNOCKBURN, ILIPC published IPC-A-600H, Acceptability of Printed Boards, and IPC-6012C, Qualification and Performance Specification for Rigid Printed Boards.

IPC-A-600H features 95 new and updated photos and illustrations, for a total of 326. The standard offers expanded coverage on topics such as solder mask coverage, etchback, plated-hole wall integrity, via fill, and flexible circuits. It also addresses copper cap-plating of vias and copper-wrap plating.

Criterion for how much a flex circuit can be bent or folded is now available. The document addresses coverlays sometimes used to protect flex circuits.

IPC-6012C addresses determining how many boards and/or test coupons to check. A document used for specifying circuit boards, IPC-6012 details frequency of inspection, instructing how many panels must be examined within a production lot for a given performance class.

Before the completion of the latest revisions, the standards’ next series of enhancements were being planned, including finer geometries, high-density PCBs, the proximity of microvias and stacked microvias that go from one layer to another.

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