SAN JOSE -- Rush PCB has begun supplying quickturn circuit boards for production and prototype orders, including PCBs with blind or buried vias. 

"With our precision laser drilling capability, we can process 4-mil microvias, for example, and blind or buried vias and more,” said CEO Roy Akber in a press release. “We handle these challenging features by using well-developed techniques and layer by layer fabrication methods that we have advanced over time." 

Akber emphasized that blind and buried vias help save PCB real estate by permitting features and lines to be designed above or below them without requiring a connection. “This helps our customers build more compact assemblies. Many of today’s fine pitch BGA and flip-chip component footprints do not allow for running traces. Instead, the blind and buried vias will only connect those layers that are required to have a connection in that specific area, allowing for PCB real estate space savings.”

Rush PCB can also fabricate stacked microvia boards up to 48 layers, and oversized boards. 

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