BANNOCKBURN, IL – IPC has released IPC-7093, Design and Assembly Process Implementation for Bottom Termination Components, a standard for the design, assembly, inspection, repair, and reliability issues associated with bottom termination components.

This class of components, including QFN, DFN, SON, LGA, MLP and MLF, has grown. QFNs, LGAs, passives and power components have shifted their contacts to the bottom of the package.

IPC-7093 provides direction for a package style that has proven difficult to manage. The standard details techniques for component placement and solder application, as well as processing issues. Reflow solder printing and reflow profile recommendations are also provided. The document also includes a number of photos and illustrations that will help users understand the root causes of problems.

The information is practical when considering tin-lead, Pb-free, adhesives or other forms of interconnection processes for assembly of BTC-type components. The document identifies many of the characteristics that influence the successful implementation of reliable assembly processes, and provides guidance information to component suppliers regarding the issues being faced in the assembly process.

To request a free download for 90 days within the publication date, email This email address is being protected from spambots. You need JavaScript enabled to view it..

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