SHANGHAI – Supernova Electronics, a leading developer and manufacturer of printed circuit boards, has unveiled plans for an initial public offering of 52.5 million shares, representing 12.01% of its total post-issuance equity. The preliminary price inquiry will take place on October 10, with subscriptions opening October 15.

The offering includes participation from Guolian Chaoying Electronics Strategic Placement No. 1 Asset Management Plan, which will acquire up to 10% of the shares. Proceeds from the IPO will fund the second phase of Supernova’s high multilayer and HDI PCB project, bolster working capital, and repay bank loans.

Supernova specializes in advanced PCB technologies, particularly for automotive electronics, and counts global Tier 1 suppliers and leading electric vehicle manufacturers among its clients. The company is one of the few domestic producers capable of mass-producing multi-level HDI and any-layer interconnect automotive boards. Industry rankings place it among the top 10 global suppliers in the automotive PCB sector and top five in China.

The new capital will expand production by an additional 3.6 million square meters annually, strengthen Supernova’s advanced HDI capabilities, and support its goal of maintaining a leadership position in the global automotive electronics supply chain.

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