SYRACUSE, NY – TTM Technologies has received a $30 million grant from the US Department of Defense to help fund an expansion of its PCB manufacturing capabilities.

The grant, facilitated through the Defense Production Act Purchases (DPAP) office, will enable TTM to acquire and install advanced manufacturing equipment and develop prototype designs for printed circuit boards. The project will begin at TTM's Centers of Excellence across the US and will ultimately culminate in integration into its new Syracuse, NY.

"The DoD requires state-of-the-art advanced printed circuit board manufacturing capability to support defense programs," said Dr. Laura Taylor-Kale, assistant secretary of defense for Industrial Base Policy. "This project provides domestic manufacturing capabilities to meet demand for current and future U.S. systems."

"This $30 million investment will help enable TTM to build a new 200,000+ square foot facility, significantly increasing domestic production of ultra-high density printed circuit boards and bolstering supply chain resilience in line with the 2024 National Defense Industrial Strategy," added Anthony Di Stasio, director of the Manufacturing Capability Expansion and Investment Prioritization directorate within OASD(IBP).

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