GYEONGGI-DO, SOUTH KOREA -- Daeduck Electronics announced the successful development of a large body FCBGA substrate for AI servers and data centers.

FCBGA (Flip-chip Ball Grid Array) is a high-density semiconductor substrate that connects semiconductor chips and package substrates using the flip-chip method and improves electrical and thermal characteristics. Daeduck Electronics knocked the FCBGA market for AI servers and data centers, which was previously dominated by global peer companies in Japan and Taiwan.

Daeduck Electronics' large body FCBGA substrate is a substrate with a size of 100mm x 100mm, with 20 or more layers, and is applied to high-performance computing (HPC) chips, which are commonly known as data center chips. Daeduck Electronics' large body FCBGA substrate can also be applied to CPUs, GPUs, and 2.5D packages known as CoWoS (Chip on Wafer on Substrate) packaging used in AI (artificial intelligence) servers. In fact, it has acquired the technological capabilities to enter all product markets that can be entered through FCBGA.

In addition, the company is preparing for another challenge in the next-generation packaging market by developing a technology that integrates silicon capacitor embedding technology, bridge integration technology, and large body FCBGA substrate technology.

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