KYOTO – Kyocera has filed a patent for a printed wiring board with a dielectric layer, first and second conductor layers, and via conductors connecting them. The via conductors have an aspect ratio greater than 1 and are arranged in a line, with one connecting them along the periphery.

The patent application describes a printed wiring board that includes a dielectric layer with first and second conductor layers on opposite surfaces, connected by a plurality of via conductors. These via conductors have an aspect ratio greater than 1, with a major axis in one direction and a minor axis in another. The board may also include a third conductor layer between the first and second layers, with via conductors arranged side by side and in contact with the third layer in specific portions.

The patent application also extends to a multilayer resonator and filter based on the PWB design. The resonator includes the same dielectric and conductor layers connected by via conductors with specific orientations and arrangements, and the filter utilizes the resonator's structure to achieve desired capabilities.

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