TOKYO – Toppan Holdings will build a semiconductor package substrate plant in Singapore, with plans to begin operations at the end of 2026.

The company said the factory is anticipated to create 200 jobs, with a capacity that will likely increase in line with demand and a total investment of 100 billion yen with the planned growth. Toppan will bear the majority of the initial 50 billion yen investment of the plant, while capacity expansions later could receive financial support from the company's main customer, Broadcom, the company said.

Toppan currently produces package substrates only at its plant in central Japan's Niigata prefecture. The planned Singapore factory will be near many back-end processing contractors that handle semiconductor assembly and testing in Malaysia and Taiwan. The company looks to boost its overall substrate production capacity 150% by fiscal 2027 compared with fiscal 2022 by expanding the Niigata facility and opening new facilities.

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