Printed Circuit Design & Fab Online Magazine - NexFlex Receives Six Bids for 100% Stake

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Printed Circuit Design & Fab Magazine

SEOUL – Six investors have submitted bids in a preliminary tender for 100% stake in NexFlex, according to reports. The sale price is estimated around 700 billion won (US$573.9 million).

NexFlex manufactures flexible copper clad laminates for smartphone and TV flex substrates. The firm supplies FCCLs to companies such as Samsung Electronics and Apple.

The company is currently held by private equity firm SkyLake Equity Partners. A final candidate is expected to be shortlisted in early April.

Its annual revenue expanded from 69 billion won in 2019 to 150 billion won in 2021.

Ed.: 1 won = US$0.00082