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Homepage Slideshow

EIPC to Hold Technical Snapshot Webinar June 16

Published: 11 June 2021
 by Chelsey Drysdale

GELEEN, THE NETHERLANDS – EIPC will hold its ninth technical snapshot webinar June 16.

William Bouwerman from MacDermid Enthone will discuss cleaning of microvia target pads. Sebastian Zarwell from Atotech will talk about Cu recrystallization and the formation of epitaxial and non-epitaxial Cu/Cu/Cu interfaces in stacked blind micro via structures. Maarten Cauwe from iMEC will look at the challenges in microvia design, modeling and testing, and Jason Furlong from PWB Interconnect Solutions will discuss IPC/IMEC/ESA testing.

Each presenter will speak for 15 minutes, and the webinar will end again with a Q&A.

For more information, visit https://eipc.org/events_eipc/technical-snapshot-webinar-june-16-2021-2/.

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