MORRISVILLE, NC — iNEMI released three additional chapters from its 2019 Roadmap: Flexible Hybrid Electronics, Organic PCB and Portable and Wireless.

The Flexible Hybrid Electronics chapter addresses technology needs and challenges of electronics systems that can bend, fold and stretch, while preserving the operational integrity of traditional electronic architectures. It discusses how advanced packaging and bare die system design are giving rise to a new field with a supporting supply chain, and it provides an update on the trends that are moving flexible electronics toward larger scale manufacturing. The chapter also reports on the latest developments in enabling technologies, such as functional inks, substrates, thin and ultra-thin die, manufacturing processes and characterization tools.

The Organic PCB chapter summarizes the technology needs for rigid PCBs, flexible circuits and optical circuits. It discusses the growing complexity of components that drive the need for complex multilayer PCB constructions, including micro-via interconnects and very fine features. It also looks at specialized materials and fabrication techniques, such as mSAP, which are required for high-speed processors and applications. Additional topics include development of optical PCBs and the associated manufacturing challenges; specific product demands of 5G communications; and how advanced technologies used for organic semiconductor packaging substrates are being adapted for advanced HDI PCBs. This chapter release updates and replaces the previously published 2019 organic PCB chapter.

The Portable and Wireless chapter discusses the key factors that have enabled portable and wireless devices to continue to be strong volume drivers of overall electronics manufacturing. It considers a variety of key products and services and how these products demand innovations in advanced packaging and design (e.g., the adoption of artificial intelligence and machine learning, which are exponentially increasing the functionality of premium-tier smartphones). Additionally, the unique challenges of 5G mmWave-based communications protocols — expected to drive disruptive changes in packaging, test strategies and integration trends in smartphone chipsets — are addressed. The impact on co-design and tool needs, as well as shifts in the supply chain structure, are also discussed.

For more information, visit https://www.inemi.org/2019-roadmap-overview.

• Prev
• Next