BINGHAMTON, NY – TTM Technologies opened an engineering center here following the acquisition of i3 Electronics.

Coupling acquired technology and engineering resources with TTM’s existing manufacturing capabilities allows TTM to expand its technology offering across defense and commercial end-markets.

The application of HyperBGA is being used in TTM’s 5G products.

“We are excited to add this cutting-edge technology to TTM’s broad base of PCB expertise in North America for deployment in both our commercial and aerospace and defense end-markets,” said Tom Edman, CEO of TTM. “We believe the acquisition of this technology will allow TTM to address key growth opportunities for advanced applications in the defense and commercial markets, aligning with TTM’s strategy to provide differentiated technical capability and value for our customers.”

TTM hired a number of engineering experts previously employed by i3.

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