SAN JOSE, CA – NextFlex announced seven award recipients for its Project Call 3.0 program to fuel the development of FHE projects, awarding $12 million in funding, including $7 million in cost-share contribution from new participants, according to reports.

Project Call 3.0 asked universities and companies to submit projects that could develop methods and components to bridge gaps in FHE manufacturing, as well as take on industry-driven problems.

Here are the seven projects that received funding this year:

1.    Boeing’s development of 3D printed passive elements that evaluate geometric and chemical behavior of printed materials to provide long-term stability for resistors, capacitors and inductors.
2.    Boeing’s large area sensor network that detects humidity, pressure, strain, temperature, etc., then communicates status in industrial systems and infrastructure.
3.    Epicore Biosystems’ thin, flexible systems for disposable “skin-like” health monitoring systems for healthcare and athletic performance.
4.    GE and Binghamton University’s disposable, clinical-grade vital sign monitoring devices designed to increase patient safety and shorten hospital stays.
5.    Lockheed Martin’s database of 3D printed antennas and microwave elements for use in military, avionics and microwave communications.
6.    Lockheed Martin and Georgia Tech’s epidermal sensors for robotic exoskeleton knee control of real-time injury management and rehabilitation for soldiers and industrial workers.
7.    The MicroConnex low-cost flexible circuit fabrication processes using roll-to-roll printing for high-volume production.

“With Project Call 3.0, we wanted to focus on the future of FHE and how it would be used to improve daily life,” said Malcolm Thompson, executive director of NextFlex. “The seven projects we’ve selected not only make exciting developments in fields like healthcare, avionics or heavy industry, but they’re creating building blocks upon which future researchers can create new applications with FHE, accelerating the pace of true FHE innovation.”

In 2017, the consortium awarded funding to Optomec, Binghamton University, GE, Intrinsiq Materials, Lockheed Martin, and the University of Maryland.

NextFlex has awarded more than $59 million in development funding. It was formed as the result of an agreement between the US Department of Defense and FlexTech Alliance in 2015.


Register now for PCB WEST, the leading trade show for the printed circuit design and electronics manufacturing industry! Coming Sept. 11-13 to the Santa Clara Convention Center.

Submit to FacebookSubmit to Google PlusSubmit to TwitterSubmit to LinkedInPrint Article