Printed Circuit Design & Fab Online Magazine - Apple to Reduce Rigid-Flex, Replace with Multi-Flex PCBs in Upcoming iPhone

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Printed Circuit Design & Fab Magazine

CUPERTINO, CA – Apple has reportedly decided to reduce rigid-flexible PCBs in its upcoming OLED iPhones, replacing them with multi-flexible PCBs, according to reports.

Scheduled for debut in September, OLED iPhones are expected to use multi-FPCB (see figure below) for the touch-screen panel because of costs and production benefits.

Previously, Apple reportedly experienced a faulty connection in the RFPCB module in the iPhone X.

It is not known if Apple will get current suppliers to make the switch, increase supplies, or replace suppliers.

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