Log in / Register
Account Login
Register
  • Forgot Username?
  • Forgot Password?
  • What is Ultra HDI?

    What is Ultra HDI?

    With Ultra HDI, small features come with big decisions.  READ MORE...

  • The Critical Nature of PCB Stackup

    The Critical Nature of PCB Stackup

    The stackup supports every layer above it.  READ MORE...

  • The PCB Design Review Process

    The PCB Design Review Process

    A structured design review process ensures alignment.  READ MORE...

  • Metal-Core PCBs and Thermal Management

    Metal-Core PCBs and Thermal Management

    Catch heat at the board.  READ MORE...

Homepage Slideshow

  • What is Ultra HDI?

    With Ultra HDI, small features come with big decisions.

    https://pcdandf.com/pcdesign/index.php/editorial/menu-features/19043-ultra-hdi-what-is-it-and-how-is-it-different-than-hdi

  • The Critical Nature of PCB Stackup

    The stackup supports every layer above it.

    https://pcdandf.com/pcdesign/index.php/editorial/menu-features/19042-the-critical-nature-of-pcb-stackup-and-how-to-build-an-efficient-one

  • The PCB Design Review Process

    A structured design review process ensures alignment.

    https://pcdandf.com/pcdesign/index.php/current-issue/241-designer-s-notebook/19037-reviewing-the-pcb-design-review-process

  • Metal-Core PCBs and Thermal Management

    Catch heat at the board.

    https://pcdandf.com/pcdesign/index.php/current-issue/293-board-talk/19039-metal-core-pcbs-and-thermal-management

  • HOME
  • Advertising
    • Sales Contacts
    • Media Kit
  • .
  • Education
    • Archives
    • News
      • Design News
      • Fab News
      • Market News
    • New Products
    • Features
    • The Route: Printed Circuit Engineering Association News
    • Editorial Contributions
    • NPI Award
    • CIRCUITS ASSEMBLY Magazine
    • White Papers/e-Books
    • Hall of Fame
    • Printed Circuit University
  • Research
    • Market Data
    • NTI-100
    • PCB Design History
    • CAD/CAM/PCB Software Providers
    • PCB Design Engineer Salary Surveys
  • .
  • PCB Update
  • .
  • Events
    • PCB West
    • Industry Events
    • PCB2Day Workshop Series
    • PCB East
  • .
  • Subscribe
  • .
  • Search
  • Home
  • Education
  • News
  • Fab News
  • CALCE Researchers Publish Product Obsolescence Management Text

Fire Damage Closes Jadason Mass Lam Plant in Dongguan for Up to 2 Weeks

Published: 02 March 2018
 by Mike Buetow

DONGGUAN, CHINA -- Jadason Enterprises' PCB materials plant here suffered a fire that could bring production to a halt for up to two weeks.

The fire started in the mass lamination plant on Thursday. Damage was contained and costs of repair will not be material to the company's financial performance, Jadason said.

There were no casualties, although it is unclear at present whether any workers or emergency personnel were injured.

  • Prev
  • Next
Submit to FacebookSubmit to Google PlusSubmit to TwitterSubmit to LinkedInPrint Article
MARCH ISSUE
February cover

View the Digital
Edition Here!

POPULAR

  • Experimental Evaluation of High-Thermal Dielectric Materials and Surface-Mount Thermal Bridges in Multilayer PCB Designs
  • The Via Revolution: Stacked, Staggered and Copper-Filled
  • The Critical Nature of PCB Stackup, and How to Build an Efficient One
  • Adhesive vs. Adhesiveless Polyimide Core Materials Used in Flex and Rigid-Flex Applications
  • The Victory Plan Reborn: Forcing the Surge of America’s Drone Industrial Base

Press Releases

  • AdvancedPCB Strengthens HDI Process Control with New AOI Investment in Chandler, AZ Facility
  • Global Tablet Shipments Decline 3% QoQ in Q4 2025 as Market Matures
  • Schmid Group Secures Major Order for Wet-Process Production Equipment Supporting AI- and HPC-Infrastructure
  • AdvancedPCB Promotes Industry Veteran John Stine to Chief Technology Officer
  • News
  • .
  • Products
  • .
  • Contacts
  • .
  • PCB Chat
  • .
  • Login

ISSN 1939-5442, Copyright © 2026 Printed Circuit Engineering Association®, PO Box 237 Portsmouth, NH 03802. All rights reserved. This website contains copyrighted material that cannot be reproduced without permission. Printed Circuit Engineering Association® Privacy Policy