PITTSBURGH -- Ansys has entered into a definitive merger agreement with Gear Design Solutions, a provider of big data analytics.

AUSTIN, TX -- A new research report helps dissect new component package options for split die.

ROME, NY -- Registration is open for the 37th Annual EOS/ESD Symposium, which takes place Sept. 27-Oct. 2 in Reno, NV.

ATLANTA – The exhibition floor is sold out for PCB West, the largest conference and exhibition for printed circuit board design, fabrication and assembly in the Silicon Valley, UP Media Group Inc. said today.