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  • Material Selection for High-Speed PCBs

    Material Selection for High-Speed PCBs

    Consider return loss and insertion loss – but don’t stop there.  READ MORE...

  • Characterizing Etchback and Dielectric Loss Tangent

    Characterizing Etchback and Dielectric Loss Tangent

    Fabrication-aware simulations to aid PCB design success.  READ MORE...

  • Sequential Lamination in PCB Manufacturing

    Sequential Lamination in PCB Manufacturing

    Manufacturing high-layer count boards.  READ MORE...

  • Implementing Flash Memory in PCB Design

    Implementing Flash Memory in PCB Design

    Routing flash has EMI implications.   READ MORE...

  • Flex Shock and Vibration

    Flex Shock and Vibration

    PSAs and carefully chosen connectors can reduce the shock of intense conditions.  READ MORE...

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Design News

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Category: Design News

DALLAS -- The 3D IC market is expected to reach $6.55 billion by 2016, a five-year CAGR of 16.9%, says a new report.

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MUNICH – Top 3 PCB design software developer Zuken has joined the recently formed ODB++ Solutions Alliance.

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SHANGHAI -- Altium has released a series of new board-level components for Maxim’s analog and mixed signal devices.

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BANNOCKBURN, IL – The industry standard that establishes requirements for the design of flexible and rigid-flex printed boards has been updated to its C revision. Read more ...

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MOUNTAIN VIEW, CA -- Synopsys today unveiled an initiative to accelerate the design of stacked die silicon systems using 3D-IC integration.

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REDWOOD CITY, CA -- Bay Area Circuits has added design services to its printed circuit board fabrication offerings.

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