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  • Material Selection for High-Speed PCBs

    Material Selection for High-Speed PCBs

    Consider return loss and insertion loss – but don’t stop there.  READ MORE...

  • Characterizing Etchback and Dielectric Loss Tangent

    Characterizing Etchback and Dielectric Loss Tangent

    Fabrication-aware simulations to aid PCB design success.  READ MORE...

  • Sequential Lamination in PCB Manufacturing

    Sequential Lamination in PCB Manufacturing

    Manufacturing high-layer count boards.  READ MORE...

  • Implementing Flash Memory in PCB Design

    Implementing Flash Memory in PCB Design

    Routing flash has EMI implications.   READ MORE...

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Design News

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Category: Design News

SAN JOSE, CA – Maxim Integrated Products has released a white paper examining how flexible power modules simplify power design.

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FLAGSTAFF, AZ -- EDA market analyst Gary Smith passed away July 3 after a short bout of pneumonia.

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MOUNTAIN VIEW, CA – Isola Group and Semico Research are launching the event Boards, Chips and Packaging: Designing to Maximize Results.

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SYDNEY -- Altium today announced fiscal fourth-quarter revenue of $23.87 million.

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SMYRNA, GA – PCD&F is undertaking its annual salary survey of printed circuit board designers, design engineers and other layout specialists.

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LYON, FRANCE – Fan-in wafer-level packaging is experiencing continuous growth and attracting new applications, a new research report says, due to "indisputable benefits" linked to cost and form factor.

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