DARMSTADT, GERMANY -- Computer Simulation Technology and Cadence Design Systems have signed a joint marketing agreement covering layout and 3D full wave simulation tools.

In a press release, CST said the companies are collaborating in order to offer an effective workflow for PCB and package layout co-design in high-speed and mixed RF systems. The joint solution offers fully automated, rigorous workflows employing 3D extraction.

The workflows offered include an "EM-centric approach" that focuses on the full wave environment, and an "EDA-centric approach" that permits the full wave simulation to be run as a fully automatic background process with back annotation of results to the layout environment.

CST of America vice president of sales & marketing Jonathan Oakley said, "Cadence and CST can together offer very effective solutions to high-speed package, system in package and PCB problems. The signing of a joint marketing agreement ensures a high level of commitment, ultimately benefitting the customer with greater expertise and more effective solutions on offer from both companies."

The Cadence Silicon Realization products combined with CST's 3D full wave extraction aligns with the EDA360 vision to offer a uniquely powerful workflow solution," said Cadence's Brad Griffin, product marketing director, SiP, IC Packaging, and PCB High-Speed Solutions.

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