SAN JOSE, CA --
Force10 Networks announced it has been awarded a patent (US Patent 7,448,132 - "Method of Manufacturing a High-Layer-Count Backplane") for its backplane circuit board design and manufacturing method for high performance switch/routers that uses a three ounce or more copper weight in a high-speed, high layer count design.
“These backplane fabrication innovations are critical to advancing our technology to ensure we’re supporting the increased traffic throughput needs of our customers at the lowest total cost of ownership,” said Joel Goergen, Force10 Networks Chief Scientist. “New and emerging applications are placing unprecedented demands on networks, while managers, more than ever, are tasked with building a cost-effective, resilient, and reliable infrastructure -- and this patent is an additional step in meeting both goals.”
The fully passive copper backplane reliability delivers a throughput of five Terabits per second. The patented fabrication method uses three ounces or heavier copper weight in a high-speed, high layer count design where there is both primary and secondary power, eliminating the need to utilize busbar technology or separate power boards to route the power. This patented capability facilitates the ability to build a single, lower-cost backplane solution for signals and power.